In contrast to conventional epoxy-encapsulated thermistors,  the ATH100KR8B3950K0.5% offers superior long-term  stability and a wider temperature range. Moreover, it has a  compact size and a quick response time.

One common issue encountered when potting the thermistor  into a solid object to sense its temperature is the formation of  air bubbles within the epoxy between the thermistor bead and  the target object. These air bubbles can significantly delay the  thermistor's response time. To address this problem, it is  recommended to drill a deep counterbore hole and use  thermal conductive epoxy to pot the thermistor at the bottom  of the hole. This method effectively  reduces the formation of air bubbles and enhances the  thermistor's overall performance.  To prevent the formation of air bubbles during the potting  process, it is recommended to cure the epoxy at the  temperature specified by the manufacturer. For optimal  results, curing should be conducted in a vacuum environment  and/or on top of a vibration platform to eliminate any  remaining air pockets. By taking these measures, the potting  process can be optimized, resulting in accurate temperature  sensing with the shortest possible response time.